Electronic device configured to collect biometric and amount of force data when a user touches a displayed image

ABSTRACT

An input device can be integrated within an electronic device and/or operably connected to an electronic device through a wired or wireless connection. The input device can include one or more force sensors positioned below a cover element of the input device or an input surface of the electronic device. The input device can include other components and/or functionality, such as a biometric sensor and/or a switch element.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.15/087,306, filed Mar. 31, 2016, and entitled “Force Sensor in an InputDevice, the contents of which are incorporated by reference as if fullydisclosed herein.

FIELD

The described embodiments relate generally to force sensing. Moreparticularly, the present embodiments relate to a force sensor in aninput device.

BACKGROUND

Many electronic devices include one or more input devices for receivinguser inputs. Devices such as smart telephones, tablet computing devices,laptop computers, wearable communication and health devices, andnavigation devices, and displays can include, or be connected to, aninput device. For example, an input device can provide information to acomputing system regarding user interaction with a graphical userinterface (GUI), such as selecting elements, returning to a home page,and other GUI features. In another example, an input device can captureor receive biometric data associated with a user and provide suchbiometric data to a computing system.

Generally, operation of an input device is binary. A key of a keyboard,for example, is either pressed sufficiently to collapse a dome switchand generate an output signal, or it is not. An input button is eitherpressed sufficiently to close a switch and select an icon, or it is not.

Binary inputs are inherently limited insofar as they can only occupy twostates (present or absent, on or off, and so on). In some situations, itmay be advantageous to also detect and measure the force of an inputthat is applied to an input device. In addition, when force is measuredacross a continuum of values, the detected force can function as anon-binary input.

SUMMARY

An input device can be included in an electronic device or operablyconnected to the electronic device using a wired or wireless connection.One or more force sensors in the input device is configured to detect aforce input that is applied to a cover element. The cover element can bea portion of the housing of the electronic device or an input surface ofthe input device disposed in an aperture of the housing.

The force sensor can employ any suitable force sensing technology, suchas capacitive, piezoelectric, piezoresistive, ultrasonic, and magneticforce sensing technologies. In one embodiment, the force sensor is acapacitive force sensor. The force sensor is formed with a first circuitlayer that includes a first set of one or more electrodes and a secondcircuit layer that includes a second set of one or more electrodes. Thesecond set of one or more electrodes is spaced apart from the first setof one or more electrodes by a compliant material (e.g., air, a siliconelayer). Each electrode in the first set is aligned in at least onedirection (e.g., vertically) with a respective electrode in the secondset to produce one or more capacitors. When a force is applied to thecover element, the cover element bends or deflects which causes at leastone electrode in the first set to move closer to a respective electrodein the second set. The capacitance of the capacitor formed by the twoelectrodes varies as the distance between the electrodes decreases. Aforce signal sensed from each capacitor represents a capacitancemeasurement of that capacitor. A processing device is configured toreceive the force signal(s) and correlate the force signal(s) to anamount of force applied to the cover element.

In one aspect, the input device includes a fingerprint sensor positionedbelow the cover element. The fingerprint sensor is configured to capturea fingerprint of a finger as the finger approaches or contacts the coverelement. A force sensor is positioned below the fingerprint sensor andover a support element. The force sensor is configured to detect a forceinput applied to the cover element.

In another aspect, an input device includes a cover element, one or morefirst force sensors positioned around a peripheral edge of the coverelement, and a second force sensor positioned below the cover element.Each first force sensor is configured to detect a first force inputapplied to the cover element. The second force sensor is configured todetect a second force input applied to the cover element. The one ormore first and the second force sensors can operate to detect forceinputs in parallel, in series, or with a time offset. For example, oneforce sensor can be used initially to detect an amount of applied force.As the amount of applied force increases, that force sensor reaches amaximum detectable force. At this point, the other force sensor may beused to detect the applied force. Alternatively, in some embodiments,both the first and second force sensors can be used to detect a forceinput up to a given amount of force, and then one of the force sensorsmay be used to detect force inputs greater than the given amount offorce.

In another aspect, an input device for use with an electronic device caninclude a cover element, a fingerprint sensor positioned below the coverelement, and a force sensor positioned below the fingerprint sensor andover a support element. The fingerprint sensor may be configured tocapture a fingerprint of a finger as the finger approaches or contactsthe cover element. The force sensor can be configured to detect a forceinput applied to the cover element. The input device may also include acompliant layer positioned below the cover element and around at least aportion of the fingerprint sensor.

In some embodiments, the input device can include additional componentsthat receive one or more inputs from a user in addition to a forceinput. For example, in one embodiment the input device includes abiometric sensor. Additionally or alternatively, the input device mayinclude a switch element that detects a user input when a force inputapplied to the cover element exceeds a given amount of force. The switchelement can generate or transmit a signal based on the detected userinput, and a processing device can register the user input based on thesignal received from the switch element.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIG. 1 shows one example of an electronic device that can include aforce sensor in one or more input devices;

FIGS. 2A-2B show exploded views of a first input device that is suitablefor use in the electronic device shown in FIG. 1;

FIG. 3 shows a cross-sectional view of the input device shown in FIG. 2Bwhen the input device is assembled;

FIG. 4 shows an exploded view of one example of the compliant layershown in FIG. 3;

FIG. 5 shows an exploded view of another example of the compliant layershown in FIG. 3;

FIG. 6 shows one example of a top view of the input device shown in FIG.3;

FIG. 7 shows another example of a top view of the input device shown inFIG. 3;

FIG. 8 shows an exploded view of a second input device that is suitablefor use in the electronic device shown in FIG. 1;

FIG. 9 shows a cross-sectional view of the second input device shown inFIG. 8 when the input device is assembled;

FIG. 10 shows an exploded view of a third input device that is suitablefor use in the electronic device shown in FIG. 1;

FIG. 11 shows a cross-sectional view of the third input device shown inFIG. 10 when the input device is assembled; and

FIG. 12 shows a block diagram of one example of an electronic devicethat can include a force sensor in one or more input devices.

The cross-hatching in the figures is provided to distinguish theelements or components from one another. The cross-hatching is notintended to indicate a type of material or materials or the nature ofthe material(s).

DETAILED DESCRIPTION

Reference will now be made in detail to representative embodimentsillustrated in the accompanying drawings. It should be understood thatthe following descriptions are not intended to limit the embodiments toone preferred embodiment. To the contrary, it is intended to coveralternatives, modifications, and equivalents as can be included withinthe spirit and scope of the described embodiments as defined by theappended claims.

The following disclosure relates to an input device that includes one ormore force sensors. The input device can be included in an electronicdevice and/or operably connected to an electronic device through a wiredor wireless connection. In one embodiment, the input device is an inputbutton, but any suitable input device can include a force sensor.

In a particular embodiment, the force sensor includes two circuit layersin a stack of components that form the input device. The circuit layersare spaced apart from each other and a compliant material or air isdisposed between the circuit layers. Each circuit layer includes a setof one or more electrodes, and each electrode in one set is aligned inat least one direction (e.g., vertically) with a respective electrode inthe other set to produce one or more capacitors. When a force is appliedto a cover element of the input device, the cover element bends ordeflects which causes at least one electrode in one circuit layer tomove closer to a respective electrode in the other circuit layer. Thecapacitance of the capacitor formed by the two electrodes varies as thedistance between the electrodes changes. A force signal sensed from eachcapacitor represents a capacitance measurement of that capacitor. Aprocessing device is configured to receive the force signal(s) andcorrelate the force signal(s) to an amount of force applied to the coverelement.

In another embodiment, the force sensor is included in a compliant layerpositioned at one or more locations within the input device. In onenon-limiting example, when the input device is an input button, thecompliant layer may be positioned around a periphery of the inputbutton. The compliant layer may be formed with a compliant materialdisposed between two circuit layers. Each circuit layer includes a setof one or more electrodes, and each electrode in one set is aligned inat least one direction (e.g., vertically) with a respective electrode inthe other set to produce one or more capacitors. When a force is appliedto an input surface of the input device, the compliant materialcompresses or deforms, which causes at least one electrode in onecircuit layer to move closer to a respective electrode in the othercircuit layer. The capacitance of the capacitor formed by the twoelectrodes varies as the distance between the electrodes decreases. Aprocessing device is configured to receive force signals from thecapacitor(s) and correlate the force signals to an amount of appliedforce.

In some embodiments, the input device can include additional componentsthat receive one or more inputs from a user in addition to a forceinput. For example, in one embodiment the input device includes abiometric sensor. In a non-limiting example, the biometric sensor is afingerprint sensor that captures at least one fingerprint when a user'sfinger (or fingers) approaches and/or contacts the input surface.

Additionally or alternatively, the input device may include a switchelement that detects a user input when a force input exceeds a givenamount of force. Any suitable switch element can be used. For example,an input device can include a dome switch that collapses when a forceapplied to an input surface exceeds a given magnitude. When collapsed,the dome switch completes a circuit that is detected by a processingdevice and recognized as an input (e.g., a selection of an icon,function, or application).

In many embodiments, force can function as a non-binary input. A forcesensor can be configured to detect different amounts of force and thedifferent amounts of force can be associated with different inputs tothe electronic device, to an application, and/or to a function. Forexample, an increasing amount of force applied to an input device can beused to increase a level of sound output by a speaker in an electronicdevice. Additionally or alternatively, a first amount of force can beassociated with a first input for an electronic device while a differentsecond amount of force may be associated with a second input. Forexample, a first amount of force can be used to wake the electronicdevice from a sleep state while a larger second amount of force may beused to turn off the electronic device. Additionally or alternatively,increasing or decreasing amounts of force can be used to control anoperation in a gaming application. For example, an increasing amount offorce may increase the speed of a moving object in a game (e.g., a car)while decreasing the amount of force can reduce the speed of the movingobject. The absence of a force input may be used as a braking functionto stop the movement of the object.

Directional terminology, such as “top”, “bottom”, “front”, “back”,“leading”, “trailing”, etc., is used with reference to the orientationof the Figure(s) being described. Because components of embodimentsdescribed herein can be positioned in a number of differentorientations, the directional terminology is used for purposes ofillustration only and is in no way limiting. When used in conjunctionwith layers of an input button or sensor, the directional terminology isintended to be construed broadly, and therefore should not beinterpreted to preclude the presence of one or more intervening layersor other intervening features or elements. Thus, a given layer that isdescribed as being formed, positioned, disposed on or over anotherlayer, or that is described as being formed, positioned, disposed belowor under another layer may be separated from the latter layer by one ormore additional layers or elements.

These and other embodiments are discussed below with reference to FIGS.1-12. However, those skilled in the art will readily appreciate that thedetailed description given herein with respect to these Figures is forexplanatory purposes only and should not be construed as limiting.

FIG. 1 shows one example of an electronic device that can include aforce sensor in one or more input devices. In the illustratedembodiment, the electronic device 100 is implemented as a smarttelephone. Other embodiments can implement the electronic devicedifferently. For example, an electronic device can be a laptop computer,a tablet computing device, a wearable computing device such as a smartwatch or a health assistant, a digital music player, a display inputdevice, a remote control device, and other types of electronic devicesthat include one or more input devices.

The electronic device 100 includes a housing 102 surrounding a display104 and an input device 106. In some embodiments, the input device 106can be configured as an input/output device. As used herein, the phrase“input device” is intended to include both input devices andinput/output devices.

The housing 102 can form an outer surface or partial outer surface forthe internal components of the electronic device 100, and may at leastpartially surround the display 104 and/or the input device 106. Thehousing 102 can be formed of one or more components operably connectedtogether, such as a front piece and a back piece. Alternatively, thehousing 102 can be formed of a single piece operably connected to thedisplay 104.

The display 104 can provide a visual output for the electronic device100 and/or function to receive user inputs to the electronic device. Forexample, the display 104 can be a multi-touch capacitive sensingtouchscreen that can detect one or more user touch and/or force inputs.The display 104 may be substantially any size and may be positionedsubstantially anywhere on the electronic device 100. The display 104 canbe implemented with any suitable display, including, but not limited to,a multi-touch sensing touchscreen device that uses liquid crystaldisplay (LCD) element, light emitting diode (LED) element, organiclight-emitting display (OLED) element, or organic electro luminescence(OEL) element.

In some embodiments, the input device 106 can take the form of a homebutton, which may be a mechanical button, a soft button (e.g., a buttonthat does not physically move but still accepts inputs), an icon orimage on a display, and so on. Further, in some embodiments, the inputdevice 106 can be integrated as part of a cover layer 108 and/or housingof the electronic device. Although not shown in FIG. 1, the electronicdevice 100 can include one or more other input devices, such as amicrophone, a speaker, other input buttons (e.g., volume, on-off), acamera, and one or more ports such as a network communication portand/or a power cord port.

The cover layer 108 may be positioned over the front surface of theelectronic device 100. At least a portion of the cover layer 108 canreceive touch and/or force inputs. In one embodiment, the cover layer108 covers the display 104 and the input device 106. Touch and forceinputs can be received by the portions of the cover layer 108 that coverthe display 104 and/or by the portion of the cover layer 108 that coversthe input device 106. In another embodiment, the cover layer 108 coversthe display 104 but not the input device 106. In such embodiments, theinput device 106 can be positioned in an opening or aperture 110 formedin the cover layer 108. The input device 106 can receive touch and/orforce inputs as well as the portion of the cover layer 108 that coversthe display 104.

In other embodiments, the input surface of the input device may beintegrated into the housing 102. For example, the input surface may bepart of the housing 102 with the force sensor and other components ofthe input device disposed below the housing 102. A depression or recessin the housing 102 may indicate the location of an input device (e.g.,an input button).

A force sensor or sensors can be included in one or more locations ofthe electronic device 100. For example, in one embodiment one or moreforce sensors may be included in the input device 106 (and/or in otherinput buttons or areas of the electronic device 100). The forcesensor(s) can be used to measure an amount of force and/or a change inforce that is applied to the input device 106. Additionally oralternatively, one or more force sensors can be positioned under atleast a portion of the housing 102 to detect a force and/or a change inforce that is applied to the housing 102. Additionally or alternatively,one or more force sensors may be included in a display stack of thedisplay 104. The force sensor(s) can be used to measure an amount offorce and/or a change in force that is applied to the display 104 or toa portion of the display 104.

Embodiments described herein include one or more force sensors in theinput device 106. As described earlier, the input device 106 may alsoinclude additional operations or devices, such as a biometric sensor,other circuitry, support elements, and/or a switch element. In oneembodiment, the various components and devices can be arranged in adevice stack that is positioned below a cover element.

FIGS. 2A-2B show exploded views of a first input device suitable for usein the electronic device shown in FIG. 1. With reference to FIG. 2A, theinput device stack 200 includes a cover element 202 and a trim 204. Inthe illustrated embodiment, the trim 204 completely surrounds the sidesof the cover element 202 and the perimeter of the top surface of thecover element 202. Other embodiments are not limited to thisconfiguration. For example, in one embodiment the sides and/or topsurface of the cover element 202 can be partially surrounded by the trim204. Alternatively, the trim 204 can be omitted in other embodiments.

Both the cover element 202 and the trim 204 can be formed with anysuitable opaque, transparent, and/or translucent material. For example,the cover element 202 can be made of glass, plastic, or sapphire and thetrim 204 may be made of a metal or plastic. In some embodiments, one ormore additional layers (not shown) can be positioned below the coverelement 202. For example, an opaque ink layer can be disposed below thecover element 202 when the cover element 202 is made of a transparentmaterial. The opaque ink layer can conceal the other components in theinput device stack 200 so that the other components are not visiblethrough the transparent cover element 202.

A first circuit layer 206 can be disposed below the cover element 202.Any suitable circuit layer may be used. For example, the first circuitlayer 206 may be a circuit board or a flexible circuit. The firstcircuit layer 206 can include one or more circuits, signal lines, and/orintegrated circuits. In one embodiment, the first circuit layer 206includes a biometric sensor 208. Any suitable type of biometric sensorcan be used. For example, in one embodiment the biometric sensor is acapacitive fingerprint sensor that captures at least one fingerprintwhen a user's finger (or fingers) approaches and/or contacts the coverelement 202.

The first circuit layer 206 may be attached to the bottom surface of thecover element 202 with an adhesive layer 210. Any suitable adhesive canbe used for the adhesive layer. For example, a pressure sensitiveadhesive layer may be used as the adhesive layer 210.

A compliant layer 212 is disposed below the first circuit layer 206. Inone embodiment, the compliant layer 212 includes an opening 214 formedin the compliant layer 212. The opening 214 exposes the top surface ofthe first circuit layer 206 and/or the biometric sensor 208 when thedevice stack 200 is assembled. In the illustrated embodiment, thecompliant layer 212 is positioned around an interior perimeter of thetrim 204 and/or around a peripheral edge of the cover element 202 (seeFIG. 3). Although depicted in a circular shape, the compliant layer 212can have any given shape and/or dimensions, such as a square or oval.The compliant layer 212 is shown as a continuous compliant layer in FIG.2, but other embodiments are not limited to this configuration. In someembodiments, multiple discrete compliant layers may be used in thedevice stack 200. Additionally, in some embodiments, the compliant layer212 does not include the opening 214 and the compliant layer 212 extendsacross at least a portion of the input device stack 200. For example,the compliant layer 212 may extend across the bottom surface of thecover element 202, the bottom surface of the first circuit layer 206, ora portion of the bottom surface of the cover element 202 (e.g., aroundthe peripheral edge of the cover element) and the bottom surface of thefirst circuit layer 206.

A second circuit layer 218 is positioned below the first circuit layer206. A flexible circuit and a circuit board are examples of a circuitlayer that can be used in the second circuit layer 218. In someembodiments, the second circuit layer 218 can include a first circuitsection 220 and a second circuit section 222. The first and secondcircuit sections 220, 222 can be electrically connected one anotherother.

The first circuit section 220 can include a first set of one or moreforce sensor components that are included in a force sensor. In someembodiments, the first circuit section 220 can be electrically connectedto the first circuit layer 206. For example, when the first circuitlayer 206 includes a biometric sensor 208, the biometric sensor 208 maybe electrically connected to the first circuit section 220 of the secondcircuit layer 218.

The second circuit section 222 can include additional circuitry, such assignal lines, circuit components, integrated circuits, and the like. Inone embodiment, the second circuit section 222 may include aboard-to-board connector 224 to electrically connect the second circuitlayer 218 to other circuitry in the electronic device. For example, thesecond circuit layer 218 can be operably connected to a processingdevice using the board-to-board connector 224. Additionally oralternatively, the second circuit layer 218 may be operably connected tocircuitry that transmits signals (e.g., sense signals) received from theforce sensor component(s) in the first circuit section 220 to aprocessing device. Additionally or alternatively, the second circuitlayer 218 may be operably connected to circuitry that provides signals(e.g., drive signals, a reference signal) to the one or more forcesensor components in the first circuit section 220.

In some embodiments, the first circuit section 220 of the second circuitlayer 218 may be attached to the bottom surface of the first circuitlayer 206 using an adhesive layer 216. In a non-limiting example, a dieattach film may be used to attach the first circuit section 220 to thebottom surface of the first circuit layer 206.

A third circuit layer 226 is disposed below the first circuit section220 of the second circuit layer 218. The third circuit layer 226 mayinclude a second set of one or more force sensor components that areincluded in a force sensor. The third circuit layer 226 is supported byand/or attached to a support element 228. In one embodiment, the supportelement 228 is attached to the trim 204 to produce an enclosure for theother components in the device stack 200. The support element 228 may beattached to the trim 204 using any suitable attachment mechanism.

The first set of one or more force sensor components in the firstcircuit section 220 and the second set of one or more force sensorcomponents in the third circuit layer 226 together form a force sensor.The force sensor can use any suitable force sensing technology. Examplesensing technologies include, but are not limited to, capacitive,piezoelectric, piezoresistive, ultrasonic, and magnetic.

In the embodiments described herein, the force sensor is a capacitiveforce sensor. With a capacitive force sensor, the first set of one ormore force sensor components can include a first set of one or moreelectrodes 230 and the second set of one or more force sensor componentsa second set of one or more electrodes 232. Although shown in a squareshape in FIGS. 2A and 2B, each electrode in the first and second sets ofone or more electrodes 230, 232 can have any given shape (e.g.,rectangles, circles). Additionally, the one or more electrodes in thefirst and second sets 230, 232 may be arranged in any given pattern(e.g., one or more rows and one or more columns).

FIGS. 2A and 2B show two electrodes in the first and second sets of oneor more electrodes 230, 232. However, other embodiments are not limitedto this configuration. The first and second sets of one or moreelectrodes 230, 232 may each be a single electrode or multiple discreteelectrodes. For example, if the first set of one or more electrodes is asingle electrode, the second set of one or more electrodes comprisesmultiple discrete electrodes. In some embodiments, the second set of oneor more electrodes can be a single electrode and the first set includesmultiple discrete electrodes. Alternatively, both the first and secondsets of one or more electrodes may each include multiple discreteelectrodes.

Each electrode in the first set of one or more electrodes 230 is alignedin at least one direction (e.g., vertically) with a respective electrodein the second set of one or more electrodes 232 to produce one or morecapacitors. When a force input is applied to the cover element 202(e.g., the input surface of the input device), at least one electrode inthe first set 230 moves closer to a respective electrode in the secondset 232, which varies the capacitance of the capacitor(s). A forcesignal sensed from each capacitor represents a capacitance measurementof that capacitor. A processing device (not shown) is configured toreceive the force signal(s) and correlate the force signal(s) to anamount of force applied to the cover element 202.

In some embodiments, the force sensor is configured to detect a range offorce inputs with at least two force inputs representing different userinputs. For example, a first force input can select an icon and adifferent second force input can turn off an electronic device.Additionally or alternatively, in another example a first force inputcan produce a scrolling operation that scrolls at a first speed and adifferent second force input may produce a scrolling operation thatscrolls at a different second speed (e.g., faster). Additionally oralternatively, in some embodiments the force sensor can replace othercomponents in an input device. For example, a force sensor may replace aswitch element.

In other embodiments, such as the embodiment shown in FIG. 2B, a switchelement 234 can be positioned below the support element 228. The switchelement 234 registers a user input when a force input applied to thecover element 202 exceeds a given amount of force (e.g., a forcethreshold associated with closing the distance between the first circuitsection 220 and the third circuit layer 226; see FIG. 3). Any suitableswitch element can be used. For example, the switch element 234 may be adome switch that collapses when the force input applied to the coverelement 202 exceeds the force threshold. When collapsed, the dome switchcompletes a circuit that is detected by a processing device andrecognized as a user input (e.g., a selection of an icon, function, orapplication). In one embodiment, the dome switch is arranged such thatthe apex of the collapsible dome is proximate to the bottom surface ofthe support plate 228. In another embodiment, the base of thecollapsible dome can be proximate to the bottom surface of the supportplate 228.

FIG. 3 shows a cross-sectional view of the input device shown in FIG. 2Bwhen the input device is assembled. In some embodiments, the trim 204 ispositioned in an aperture formed in the housing of an electronic device(e.g., aperture 1010 in housing 102 in FIG. 1). In the illustratedembodiment, the trim 204 includes a shelf 300 that extends inward fromthe trim 204 toward the input device stack. The compliant layer 212 ispositioned between the shelf 300 and a peripheral edge of the coverelement 202. The compliant layer 212 may be made of any suitablematerial or materials. For example, in one embodiment the compliantlayer 212 is a silicone layer.

In another embodiment, the compliant layer 212 can be formed as shown inFIG. 4. A compliant material 400 may be positioned between twointermediate layers 402, 404. An exterior layer 406, 408 can be disposedover each intermediate layer 402, 404. In one non-limiting embodiment,the compliant material 400 may be formed with silicone, the intermediatelayers 402, 404 can be formed with a polyimide, and the exterior layers406, 408 may be formed with a heat activated film.

FIG. 5 shows an exploded view of another example of the compliant layershown in FIG. 3. A compliant material 500 may be positioned between twocircuit layers 502, 504. A first set of one or more force sensorcomponents 506 is formed in or on the first circuit layer 502.Similarly, a second set of one or more force sensor components 508 isformed in or on the second circuit layer 504. In the illustratedembodiment, the first and second sets of one or more force sensorcomponents each include one or more electrodes.

An exterior layer 510, 512 can be disposed over each circuit layer 502,504. In one non-limiting embodiment, the compliant material 500 may beformed with silicone, each circuit layer 502, 504 can be formed with aflexible circuit that includes a set of one or more electrodes (e.g.,230, 232), and each exterior layer 510, 512 may be formed with a heatactivated film.

The circuit layers 502, 504 allow the compliant layer 212 to act as asecond force sensor. The second force sensor can be used in series,concurrently, or offset in time with the first force sensor formed bythe second and third circuit layers 218, 226. For example, one forcesensor (e.g., the second force sensor) can be used initially to detectan amount of applied force. As the amount of applied force increases,the force sensor reaches a maximum detectable force. At this point, theother force sensor (e.g., the first force sensor) may be used to detectthe applied force. Alternatively, in some embodiments, both the firstand second force sensors can be used to detect force inputs up to agiven amount of force, and then one of the force sensors may be used todetect force inputs greater than the given amount of force.

The second capacitive force sensor operates similarly to the firstcapacitive force sensor. Each electrode in the first set of one or moreelectrodes 506 is aligned in at least one direction (e.g., vertically)with a respective electrode in the second set of one or more electrodes508 to produce one or more capacitors 514. As described earlier, thecapacitance of at least one capacitor 514 can vary when a user applies aforce to the cover element 202 because the electrodes in at least onecapacitor 514 move closer together. A user can apply the force to thecover element 202 with a device, such as a stylus, or with a body part(e.g., one or more fingers). Force signals produced by the one or morecapacitors 514 represent capacitance measurement(s) of the one or morecapacitors 514. A processing device that receives the force signal(s) isconfigured to correlate the force signal(s) to an amount of forceapplied to the cover element 202.

Retuning to FIG. 3, the compliant layer 212 can seal the interfacebetween the bottom surface of the cover element 202 and the top surfaceof the shelf 300. In some embodiments, the compliant layer 212 may actas an environmental seal that prevents contaminants, such as water,chemicals, and dirt, from entering the input device stack and/or theelectronic device.

The first circuit layer 206 (with the biometric sensor 208) ispositioned below the cover element 202, and the second circuit layer 218is positioned below the first circuit layer 206. The third circuit layer226 is disposed below the second circuit layer 218 and over the supportelement 228. In the illustrated embodiment, the support element 228 isattached to the trim 204 using fasteners 302. Any suitable type offastener may be used, such as a screw, solder, and an adhesive.

In the illustrated embodiment, a gap 304 is defined between the secondand third circuit layers 218, 226. The gap 304 is formed based at leastin part by the downward step 305 in the support element 228. Asdescribed earlier, when the force sensor is a capacitive force sensor,the electrode(s) in the first and second sets of one or more electrodesform a capacitor. The gap 304 separates the electrodes in the first andsecond sets and includes the dielectric material for the capacitor(s).Any suitable dielectric material can be used. For example, thedielectric material can include, but is not limited to, air, a compliantgel, a compliant material, and/or one or more compliant elementsdisposed between the second and third circuit layers 218, 226.

In the illustrated embodiment, the cover element 202 and the trim 204are fixed in position and do not move when a force is applied to thecover element 202. The gap 304 permits the first circuit section 220 ofthe second circuit layer 218 to bend or deflect relative to the thirdcircuit layer 226 when a force input is applied to the cover element202. This deflection varies the capacitance of one or more capacitorsformed by the electrode(s) in the first circuit section 220 and thirdcircuit layer 226.

In some embodiments, additional circuitry and/or components may beattached and electrically connected to the second circuit layer 218. Forexample, a second integrated circuit 306 may be attached andelectrically connected to the second circuit layer 218. In someembodiments, some additional circuitry may be encapsulated with aprotective and/or insulting material 308. The protective and/orinsulating material 308 can filter noise from signals and circuitry inor on the second circuit layer 218. In the illustrated embodiment, theprotective and/or insulating material 308 extends into an opening 236formed in the support element 228 (see FIGS. 2A-2B).

As discussed earlier, a switch element 234 may be disposed below thesupport element 228. The switch element 234 is depicted as a dome switchin FIG. 3. As shown, the dome switch is arranged such that the base ofthe collapsible dome is proximate (e.g., attached) to the bottom surfaceof the support plate 228. In other embodiments, the apex of thecollapsible dome may be proximate to, or in contact with, the bottomsurface of the support plate 228.

FIG. 6 shows one example of a top view of the input device shown in FIG.3. The cover element 202 is omitted for clarity. In this exampleembodiment, the compliant layer 212 is formed as a continuous ring ofcompliant material that is positioned around the trim 204 (e.g., overshelf 300 of the trim 204 in FIG. 3). As discussed earlier, thecompliant layer 212 may act as an environmental seal that preventscontaminants, such as water, chemicals, and dirt, from entering theinput device stack and/or the electronic device. In such embodiments,the corners 600 of the first circuit layer 206 (and/or the biometricsensor 208) may be notched to ensure the compliant layer 212 meets allstandards for an environmental seal, such as a width requirement.

The adhesive layer 210 is used to attach the first circuit layer 206 tothe bottom surface of the cover element. Additionally, in someembodiments the second circuit layer 218 extends beyond the trim 204 andfolds over itself to provide a circuit layer. For example, in someembodiments the third circuit layer 226 can be a part of the secondcircuit layer 218 that is folded over and positioned over the supportelement 228.

FIG. 7 shows another example of a top view of the input device shown inFIG. 3. Again, the cover element 202 is omitted for clarity. In thisexample embodiment, the compliant layer 212 is formed as discretecompliant layers 700, 702, 704, 706 that are positioned at differentlocations around the trim 204 (e.g., over the shelf 300 in FIG. 3). Insuch embodiments, the edges and corners of the first circuit layer 206do not have to be modified or notched. Additionally or alternatively, insome embodiments the dimensions or size of the biometric sensor can belarger when discrete compliant layers are included in the input device.Although only four discrete compliant layers are shown in FIG. 7, otherembodiments can include any number of discrete compliant layers.

An environmental seal can be formed with a material that fills the gaps708 around the discrete compliant layers 700, 702, 704, 706 and betweenthe cover element 202 and the trim 204. In one embodiment, the materialis water and chemical resistance and is compliant relative to thediscrete compliant layers 700, 702, 704, 706. The environmental sealprevents contaminants such as liquid, dirt, and dust from entering theinput device stack and/or the electronic device. In a non-limitingexample, a glue may be used to form the environmental seal.

FIG. 8 shows an exploded view of a second input device that is suitablefor use in the electronic device shown in FIG. 1. The input device stack800 is inverted in FIG. 8, with the cover element 802 shown at thebottom of the figure. As described earlier, one or more additionallayers 804 can be positioned below the cover element 802. The additionallayer(s) can include, but are not limited to, an ink layer and/or anadhesive layer.

A first circuit layer 806 may be positioned below the cover element 802(or below the additional layer(s) 804 when included in the input devicestack 800). The first circuit layer 806 may be any suitable circuitlayer, such as a circuit board or a flexible circuit. In one embodiment,the first circuit layer 806 includes a biometric sensor 808 formed on orin the first circuit layer 806 and operably connected to the firstcircuit layer 806. In a non-limiting example, the biometric sensor 808is a fingerprint sensor.

In some embodiments, the first circuit layer 806 and the biometricsensor 808 can be molded into a plastic mold or enclosure 809. Theplastic enclosure 809 can serve as an environmental seal for the firstcircuit layer 806 and the biometric sensor 808.

A support layer 810 can be disposed below the first circuit layer 806.The support layer 810 may include circuitry 812, 814, 816 electricallyconnected to a second circuit layer 818. The second circuit layer 818may be a flexible circuit or a circuit board. In the illustratedembodiment, the second circuit layer 818 is a flexible circuit thatincludes a second circuit layer tail 820 that extends into the opening822 in the trim 824.

In some embodiments, circuitry 812, 814, and/or 816 may be electricallyconnected to contacts 826, 828 on the first circuit layer 806. In someembodiments, at least a portion of circuitry 812 may extend into theopening 830 in the trim 824. The circuitry 812, 814, and/or 816 may beencapsulated with an insulating and/or protective material (not shown).

A compliant layer 832 is positioned below the support layer 810. In theillustrated embodiment, the compliant layer 832 includes an opening 833that permits the compliant layer 832 to reside around the interiorperimeter of the trim 824 and/or around a peripheral edge of the coverelement 802. Although depicted in a circular shape, the compliant layer832 can have any given shape and/or dimensions, such as a square oroval. As discussed earlier, the compliant layer 832 may include multiplediscrete compliant layers in the device stack 800. Additionally oralternatively, the compliant layer 832 may not include the opening 833such that the compliant layer 832 extends across at least a portion ofthe input device stack 800. For example, the compliant layer 832 mayextend across the bottom surface of the cover element 802, the bottomsurface of the first circuit layer 806, or a portion of the bottomsurface of the cover element 802 (e.g., around the peripheral edge ofthe cover element) and the bottom surface of the first circuit layer806.

The compliant layer 832 may be made of any suitable material orcombination of materials. For example, in one embodiment the compliantlayer 832 can be formed with silicone. In other embodiments, thecompliant layer 832 can be constructed as shown in FIG. 4 or in FIG. 5.The compliant layer 832 may function as an additional force sensor whenthe compliant layer 832 is constructed as shown in FIG. 5.

A third circuit layer 834 may be disposed below the support layer 810.The third circuit layer 834 may be any suitable circuit layer, such as acircuit board or a flexible circuit. In the illustrated embodiment, thethird circuit layer 834 is a flexible circuit that includes a circuitlayer tail 836 that extends into the opening 822 of the trim 824.

The trim 824 forms a container or holder in that the trim 824 includes acavity defined by the bottom surface and sides of the trim 824. Whenconstructed, the cover element 802, the optional one or more additionallayers 804, the first circuit layer 806, the support layer 810, thesecond circuit layer 818, the compliant layer 832, and the third circuitlayer 834 all reside within the cavity of the trim 824. The bottomsurface of the trim 824 acts as a support element for the third circuitlayer 834.

In one embodiment, the second and third circuit layers 818, 834 eachinclude a set of one or more force sensor components that are includedin a force sensor. The force sensor can use any suitable sensingtechnology. For example, with a capacitive force sensor, the second andthird circuit layers 818, 834 each include one or more electrodes (notshown) that are used to sense changes in capacitance. The electrode(s)may be configured as shown and described in conjunction with FIGS.2A-2B. A processing device (not shown) receives force signals thatrepresent capacitance values for the one or more capacitors formed bythe electrode(s). A processing device (not shown) receives force signalsfrom the one or more capacitors and correlates the force signals into anamount of force that is applied to the cover element 802.

FIG. 9 shows a cross-sectional view of the second input device shown inFIG. 8 when the input device is assembled. In the illustratedembodiment, the trim 824 is positioned in an aperture 900 formed in thehousing 902 of an electronic device (e.g., housing 102 in FIG. 1).Disposed within the trim 824 are the cover element 802 and the variouslayers of the input device stack 800 (e.g., the optional additionallayer(s) 804, the first circuit layer 806, the support layer 810, thesecond circuit layer 818, the third circuit layer 834, and the compliantlayer 832). The second circuit layer tail 820 and the third circuitlayer tail 836 extend out of the trim 824 through the opening 822. Thesecond and third circuit layer tails 820, 836 can be operably connectedto other circuitry, such as a processing device and/or signal generator.

As discussed earlier, the second and third circuit layers 818, 834 canbe included in a force sensor. The second and third circuit layers 818,834 may each include a set of one or more force sensor components thatare included in the force sensor. For example, with a capacitive forcesensor the second and third circuit layers 818, 834 can each include aset of one or more electrodes (not shown). The one or more electrodesmay be configured as shown and described in conjunction with FIGS.2A-2B.

As described earlier, the second and third circuit layer tails 820, 836may be operably connected to one or more processing devices (not shown).The force signals received from the force sensor (e.g., capacitor(s)formed with electrodes) can be transmitted to a processing device usingone circuit layer tail (e.g., second circuit layer tail 820).Additionally, drive or reference signals may be transmitted to the forcesensor (e.g., capacitor(s) formed with electrodes) using the othercircuit layer tail (e.g., third circuit layer tail 836).

A gap 912 is defined between the second and third circuit layers 818,834. As described earlier, when the force sensor is a capacitive forcesensor, the gap 912 includes the dielectric material for thecapacitor(s) that is formed with the sets of one or more electrodes inthe second and third circuit layers 818, 834. The gap 912 permits thesecond circuit layer 818 to move, bend, or deflect relative to the thirdcircuit layer 834 when a force input is applied to the cover element802. This deflection varies the capacitance of one or more capacitorsformed by the electrode(s) in the second and third circuit layers 818,834.

In the illustrated embodiment, the second circuit layer 818 iselectrically connected to the first circuit layer 806 with bonding wires904. The bonding wires 904 may be covered or encapsulated by aprotective and/or insulating material 906.

In some embodiments, a seal 908 can be disposed between the trim 824 andthe housing 902. In one embodiment, the seal is an O-ring that ispositioned within an indentation 910 formed along an exterior surface ofthe trim 824. The seal 908 can function as an environmental seal thatprevents contaminants such as liquid, dirt, and dust from entering theinput device stack and/or the electronic device.

FIG. 10 shows an exploded view of a third input device that is suitablefor use in the electronic device shown in FIG. 1. Like the embodimentshown in FIG. 8, the input device stack 1000 is shown inverted with thecover element 1002 shown at the bottom of the figure. In someembodiments, one or more additional layers 1004 can be positioned belowthe cover element 1002. The additional layer(s) can include, but are notlimited to, an ink layer and/or an adhesive layer.

A first circuit layer 1006 may be positioned below the cover element1002 (or below the additional layer(s) 1004 when included in the inputdevice stack 1000). The first circuit layer 1006 may be any suitablecircuit layer, such as a circuit board or a flexible circuit. In oneembodiment, the first circuit layer 1006 includes a biometric sensor1008 formed on or in the first circuit layer 1006 and operably connectedto the first circuit layer 1006. In a non-limiting example, thebiometric sensor 1008 is a fingerprint sensor.

Like the embodiment shown in FIG. 8, the first circuit layer 1006 andthe biometric sensor 1008 can be molded into a plastic mold or enclosure1009. The plastic enclosure 1009 can serve as an environmental seal forthe first circuit layer 1006 and the biometric sensor 1008.

A support layer 1010 can be disposed below the first circuit layer 1006.The support layer 1010 may include circuitry 1012, 1014, 1016electrically connected to a second circuit layer 1018. The secondcircuit layer 1018 may be a flexible circuit or a circuit board. In someembodiments, the circuitry 1012, 1014, and/or 1016 may be electricallyconnected to one or both contacts 1020, 1022 on the first circuit layer1006. In some embodiments, at least a portion of the circuitry 1012,1014, and/or 1016 may extend into the opening 1024 in the trim 1026.

A compliant layer 1028 is positioned below the support layer 1010. Inthe illustrated embodiment, the compliant layer 1028 includes an opening1030 that permits the compliant layer 1028 to reside around the interiorperimeter of the trim 1026 and/or a peripheral edge of the cover element1002. Although depicted in a circular shape, the compliant layer 1028can have any given shape and/or dimensions, such as a square or an oval.As discussed earlier, in some embodiments the compliant layer 1028 maybe configured as multiple discrete compliant layers in the device stack1000. Additionally or alternatively, the compliant layer 1018 may notinclude the opening 1024 such that the compliant layer 1028 extendsacross at least a portion of the input device stack 1000. For example,the compliant layer 1028 may extend across the bottom surface of thecover element 1002, the bottom surface of the first circuit layer 1006,or a portion of the bottom surface of the cover element 1002 (e.g.,around the peripheral edge of the cover element) and the bottom surfaceof the first circuit layer 1006.

The compliant layer 1028 may be made of any suitable material orcombination of materials. For example, in the illustrated embodiment thecompliant layer 1028 functions as a force sensor and is constructed asshown in FIG. 5. The compliant layer 1028 includes a compliant layertail 1032 that extends out of the opening 1024 (see FIG. 11). Thecompliant layer tail 1032 is described in more detail in conjunctionwith FIG. 11.

When constructed, the cover element 1002 and the various layers of theinput device stack 1000 (e.g., the optional one or more additionallayers 1004, the first circuit layer 1006, the support layer 1010, andthe compliant layer 1028) all reside within the trim 1026. FIG. 11 showsa cross-sectional view of the third input device shown in FIG. 10 whenthe input device is assembled. In the illustrated embodiment, the trim1026 is positioned in an aperture 1100 formed in the housing 1102 of anelectronic device (e.g., housing 102 in FIG. 1). Disposed within thetrim 1026 are the cover element 1002, the first circuit layer 1006, thebiometric sensor 1008, the support layer 1010, the second circuit layer1018, and the compliant layer 1028. The compliant layer tail 1032extends out of the trim 1026 through the opening 1024.

In the illustrated embodiment, the compliant layer 1028 is constructedas shown in FIG. 5 and functions as a capacitive force sensor. Thecompliant layer tail 1032 includes a first flexible circuit 1104 and asecond flexible circuit 1106. Both the first and second flexiblecircuits 1104, 1106 each include one or more electrodes in at least theportion of the compliant layer 1028 that is disposed around the interiorperimeter of the trim 1026. For example, in one embodiment theelectrode(s) can be configured as shown and described in conjunctionwith FIG. 5.

The flexible circuits 1104, 1106 are operably connected to a processingdevice (not shown). The processing device is adapted to cause areference or drive signal to be transmitted by one of the flexiblecircuits (e.g., 1104) to the one or more electrodes in that flexiblecircuit. The other flexible circuit (e.g., 1106) receives force signalsfrom the one or more capacitors in formed by the electrodes andtransmits the force signals to a processing device (not shown). Theprocessing device is adapted to correlate the force signals into anamount of force that is exerted on the cover element 1002.

In some embodiments, a seal 1108 can be disposed between the trim 1026and the housing 1102. In one embodiment, the seal is an O-ring that ispositioned within an indentation 1110 formed along an exterior surfaceof the trim 1026. The seal 1108 can function as an environmental sealthat prevents contaminants such as liquid, dirt, and dust from enteringthe input device stack and/or the electronic device.

It should be noted that the embodiments shown in FIGS. 2 and 3, FIGS. 8and 9, and FIGS. 10 and 11 are exemplary only. In other examples, theinput device may include fewer or more components than those describedand/or shown in the figures. For example, the first circuit layer 206,806, 1006 and the biometric sensor 208, 808, 1008 can be omitted in someembodiments. Additionally or alternatively, the switch element 234 maybe omitted from the embodiment shown in FIGS. 2B and 3, or the switchelement 234 may be included in the embodiments illustrated in FIGS. 8and 9 and/or FIGS. 10 and 11.

Although the input device 106 is shown in FIG. 1 as a circular inputdevice, other embodiments are not limited to this configuration. Aninput device can have any given shape and/or dimensions. Similarly, theshape and/or dimensions of the components shown in FIGS. 2-11 areillustrative only. Each component may have any given shape and/ordimensions.

FIG. 12 shows a block diagram of one example of an electronic devicethat can include a force sensor in one or more input devices. Theelectronic device 1200 can include one or more processing devices 1202,memory 1204, one or more input/output devices 1206, a power source 1208,one or more sensors 1210, a network/communication interface 1212, adisplay 1214, and one or more input devices 1216 that include at leastone force sensor 1218. Each of these components is discussed in moredetail below.

The one or more processors 1202 can control some or all of theoperations of the electronic device 1200. The processing device(s) 1202can communicate, either directly or indirectly, with substantially allof the components of the device. For example, one or more system buses1220 or other communication mechanisms can provide communication betweenthe processing device(s) 1202, the memory 1204, the input/outputdevice(s) 1206, the power source 1208, the one or more sensors 1210, thenetwork/communication interface 1212, the display 1214, the inputdevice(s) 1216, and/or the force sensor(s) 1218. The processingdevice(s) 1202 can be implemented as any electronic device capable ofprocessing, receiving, or transmitting data or instructions.Additionally, the processing device 1202 can be configured to receivethe force signals from the force sensor 1218 and correlate the forcesignals to an amount of force. For example, the one or more processingdevices 1202 can be a microprocessor, a central processing unit (CPU),an application-specific integrated circuit (ASIC), a digital signalprocessor (DSP), or combinations of multiple such devices. As describedherein, the term “processing device” is meant to encompass a singleprocessor or processing unit, multiple processors, multiple processingunits, or other suitably configured computing element or elements.

The memory 1204 can store electronic data that can be used by theelectronic device 1200. For example, the memory 1204 can storeelectrical data or content such as audio files, document files, timingand control signals, and image data. The memory 1204 can be configuredas any type of memory. By way of example only, memory 1204 can beimplemented as random access memory, read-only memory, Flash memory,removable memory, or other types of storage elements, in anycombination.

The one or more input/output devices 1206 can transmit and/or receivedata to and from a user or another electronic device. Exampleinput/output device(s) 1206 include, but are not limited to, a touchsensing input device such as a touchscreen or track pad, a microphone, avibration or haptic device, and/or a speaker.

The power source 1208 can be implemented with any device capable ofproviding energy to the electronic device 1200. For example, the powersource 1208 can be one or more batteries or rechargeable batteries, or aconnection cable that connects the electronic device to another powersource such as a wall outlet.

The electronic device 1200 may also include one or more sensors 1210positioned substantially anywhere on or in the electronic device 1200.The sensor or sensors 1210 may be configured to sense substantially anytype of characteristic, such as but not limited to, images, atmosphericpressure, light, touch, temperature, heat, movement, relative motion,biometric data, and so on. For example, the sensor(s) 1210 may be animage sensor, a temperature sensor, a light or optical sensor, anaccelerometer, a gyroscope, a magnet, a barometer, a health monitoringsensor, and so on.

The network communication interface 1212 can facilitate transmission ofdata to or from other electronic devices. For example, a networkcommunication interface can transmit electronic signals via a wirelessand/or wired network connection. For example, in one embodiment acommunication signal is transmitted to a transmitter device and/or to areceiver device to permit the transmitter and receiver devices tocommunication with one another. Examples of wireless and wired networkconnections include, but are not limited to, cellular, Wi-Fi, Bluetooth,infrared (IR), Ethernet, and Near Field Communication (NFC).

The display 1214 can provide a visual output to the user. The display1214 can be implemented with any suitable technology, including, but notlimited to, a multi-touch sensing touchscreen that uses liquid crystaldisplay (LCD) element, light emitting diode (LED) element, organiclight-emitting display (OLED) element, organic electroluminescence (OEL)element, or another type of display element. In some embodiments, thedisplay 1214 can function as an input device that allows the user tointeract with the electronic device 1200. For example, the display canbe a multi-touch touchscreen display.

The electronic device 1200 further includes one or more input devices1216. Each input device 1216 can include a force sensor 1218 that isconfigured as one of the force sensors shown in FIGS. 2 and 3, 8 and 9,or 10 and 11. As described earlier, the processing device 1202 canprocess the force signals that are received from the force sensor(s)1218 and correlate the force signals to an amount of force.

It should be noted that FIG. 11 is exemplary only. In other examples,the electronic device may include fewer or more components than thoseshown in FIG. 11. Additionally or alternatively, the electronic devicecan be included in a system and one or more components shown in FIG. 11is separate from the electronic device but in communication with theelectronic device. For example, an electronic device may be operativelyconnected to, or in communication with a separate display. As anotherexample, one or more applications or data can be stored in a memoryseparate from the electronic device. As another example, a processingdevice in communication with the electronic device can control variousfunctions in the electronic device and/or process data received from theelectronic device. In some embodiments, the separate memory and/orprocessing device can be in a cloud-based system or in an associateddevice.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of the specificembodiments described herein are presented for purposes of illustrationand description. They are not targeted to be exhaustive or to limit theembodiments to the precise forms disclosed. It will be apparent to oneof ordinary skill in the art that many modifications and variations arepossible in view of the above teachings.

What is claimed is:
 1. An electronic device, comprising: a housing; acover layer attached to the housing and forming at least part of a frontsurface of the electronic device; a display at least partiallysurrounded by the housing and disposed under the cover layer; an inputdevice comprising an image displayed by the display; a set of one ormore force sensors positioned around a peripheral edge of an opening inthe cover layer and configured to detect a force input applied to theinput device; and a fingerprint sensor positioned in a stack ofcomponents including the cover layer and the display, and at leastpartially in the opening, the fingerprint sensor configured to capture afingerprint when a finger presses on the cover layer above the inputdevice.
 2. The electronic device of claim 1, wherein the set of one ormore force sensors comprises a set of one or more capacitive forcesensors.
 3. The electronic device of claim 2, wherein the fingerprintsensor comprises a capacitive fingerprint sensor.
 4. The electronicdevice of claim 1, further comprising: a device stack; wherein: the setof one or more force sensors comprises at least one force sensor in thedevice stack; and the device stack includes the display.
 5. Theelectronic device of claim 1, further comprising: a flexible circuit;and a connector, electrically connected to the flexible circuit;wherein: the fingerprint sensor is electrically connected to theflexible circuit, and electrically connected to the connector via theflexible circuit.
 6. The electronic device of claim 1, wherein thedisplay comprises a liquid crystal display (LCD) element.
 7. Anelectronic device, comprising: a housing; a display at least partiallysurrounded by the housing and configured to detect a touch input; acover layer positioned above the display and configured to receive touchand force inputs applied to the electronic device above the display; aninput device, comprising: an image displayed by the display; a set ofone or more force sensors disposed under the display; and a fingerprintsensor positioned below the display and above the set of one or moreforce sensors, and configured to capture a fingerprint when a fingerpresses on the cover layer above the fingerprint sensor.
 8. Theelectronic device of claim 7, further comprising: a device stack;wherein: the set of one or more force sensors comprises at least oneforce sensor in the device stack; and the device stack includes thedisplay.
 9. The electronic device of claim 7, further comprising: asupport element; wherein: at least one force sensor in the set of one ormore force sensors is positioned between the fingerprint sensor and thesupport element.
 10. The electronic device of claim 7, wherein thefingerprint sensor comprises a capacitive fingerprint sensor.
 11. Theelectronic device of claim 7, further comprising: a compliant layerhaving a center opening; wherein: the fingerprint sensor is positionedin the center opening.
 12. The electronic device of claim 7, furthercomprising: a flexible circuit; and a connector, electrically connectedto the flexible circuit; wherein: the fingerprint sensor is electricallyconnected to the flexible circuit, and electrically connected to theconnector via the flexible circuit.
 13. An electronic device,comprising: a housing; a device stack, comprising: a display at leastpartially surrounded by the housing and configured to detect a touchinput; and a set of one or more force sensors; an input device,comprising: an image displayed by the display; and a biometric sensor; acover layer disposed over the display and the biometric sensor; wherein:at least one force sensor in the set of one or more force sensorsdisposed under the biometric sensor, wherein the at least one forcesensor is configured to measure an amount of force applied to the inputdevice; and the biometric sensor is configured to capture biometric dataassociated with a user of the electronic device who touches thedisplayed image.
 14. The electronic device of claim 13, wherein the atleast one force sensor forms part of the input device.
 15. Theelectronic device of claim 13, wherein the biometric sensor is disposedin the device stack.
 16. The electronic device of claim 13, wherein thebiometric sensor comprises a fingerprint sensor.
 17. The electronicdevice of claim 16, wherein the fingerprint sensor is configured tocapture a fingerprint when a finger presses on the cover layer above theinput device.
 18. The electronic device of claim 13, wherein the set ofone or more force sensors comprises multiple force sensors positionedaround a center of the input device.